Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering

Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering
Eachine1
sku: 1235970
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$5.99
Shipping from: China
   Description
Features Efficient quick alignment for operating of reballingEasy positioning pins for precise alignmentDurable Long Time Operating and Usage LifetimeApplication Model iphone 8 Plus 8Function Repairing or fixing problem of iphone 6s Plus 6s processor Package includes 1 x BGA Reballing Stencils for iPhone 8 8P Details pictures
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