S400 3D BGA Reballing Stencil Power Logic Module BGA Reballing Repair Tool for iPhone 5 5S 6 6S 7G 7Plus 8 8P

S400 3D BGA Reballing Stencil Power Logic Module BGA Reballing Repair Tool for iPhone 5 5S 6 6S 7G 7Plus 8 8P
Eachine1
sku: 1463044
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$6.90
Shipping from: China
   Description
Features: 3D laser square hole BGA reballing stencil template. High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. New patented iphone X Middle Layer Motherboard for iPhone X Middle layer motherboard. Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way. Specification: Type: for iPHone 8/8p / for iPHone 7/7p / for iPHone 6s/6sp / for iPHone 6/6p Package included: 1 x BGA Reballing Tool Details pictures:
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