Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net

Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net
Eachine1
sku: 1235960
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$5.01
Shipping from: China
   Description
Features: Efficient: quick alignment for operating of reballing Easy: positioning pins for precise alignment Durable: Long Time Operating and Usage Lifetime Application Model: iphone 6s Plus, 6s Function: Repairing or fixing problem of iphone 6s Plus 6s processor Package includes: 1 x BGA Reballing Stencils for iPhone 6s/6SP Details pictures:
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