Japan Steel Phone Logic Board BGA Repair Stencil Tool for iPhone 7 7P Motherboard IC Chip Ball Soldering Net

Japan Steel Phone Logic Board BGA Repair Stencil Tool for iPhone 7 7P Motherboard IC Chip Ball Soldering Net
Eachine1
sku: 1235982
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$9.99
Shipping from: China
   Description
Features Efficient quick alignment for operating of reballingEasy positioning pins for precise alignmentDurable Long Time Operating and Usage LifetimeApplication Model iphone 7 7P Function Repairing or fixing problem of iphone 7 7P processor Package includes 1 x BGA Reballing Stencils for iPhone 7 7P Details pictures
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