For eMMC EMCP BGA221 153 169 254 162 186 BGA Stencil Reballing Pins BGA Direct Heating Template 0.15mm Thickness Anti Drum-up

For eMMC EMCP BGA221 153 169 254 162 186 BGA Stencil Reballing Pins BGA Direct Heating Template 0.15mm Thickness Anti Drum-up
sku: 32894168182
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$3.99
Shipping from: China
   Technical Details
Brand Name: HONGPU
Compatible Brand: Apple iPhones
Model Number: FOR BGA NAND STENCIL
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