BGA Reballing Stencil for EMMC/EMCP BGA221 153 169 254 162 186 Reballing Template Soldering Net Thickness 0.15mm

BGA Reballing Stencil for EMMC/EMCP BGA221 153 169 254 162 186 Reballing Template Soldering Net Thickness 0.15mm
sku: 33026251480
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$4.80
Shipping from: China
   Technical Details
Function: BGA Stencil for BGA221 153 169 254 162 186
Material: Stainless Steel
Model Number: Stencil BGA
Particle Size: 1-10μm
Style: BGA Stencil for EMMC EMCP
Thickness: 0.15mm
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