For EMMC EMCP BGA221 153 169 254 162 186 BGA Stencil Direct Heating Template 0.12mm Thickness
Technical Details
Application: | Mobile Phone |
Brand Name: | jestar |
Condition: | New |
Dissipation Power: | BGA reballing stencil |
is customized: | Yes |
Model Number: | EMMC EMCP BGA221 153 169 254 162 186 |
Operating Temperature: | BGA reballing stencil |
Package: | SMD |
Supply Voltage: | BGA reballing stencil |
Type: | BGA reballing stencil |
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