Qianli iBlack 3D набор трафаретов для пайки BGA для Android Qualcomm EMMC DDR MTK 6582 MSM8916 8917 8909 8939 8953 Kirin 665 8940
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Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK 6582 MSM8916 8917 8909 8939 8953 8940 Kirin 665 659
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Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK 6582 MSM8916 8917 8909 8939 8953 8940 Kirin 665 659
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Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK 6582 MSM8916 8917 8909 8939 8953 8940 Kirin 665 659
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Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK 6582 MSM8916 8917 8909 8939 8953 8940 Kirin 665 659
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Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK 6582 MSM8916 8917 8909 8939 8953 8940 Kirin 665 659
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Qianli iBlack 3D EMMC DDR Android BGA Reballing Stencil for Qualcomm EMMC DDR MTK 6582 MSM8916 8917 8939 8953 8940 Kirin 665
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Qinali iBlack 3D Positioning Black Reballing Stencil for Android Reballing Stencil for EMMC DDR MSM8916 8917 8909 8939 8953 8940
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QIANLI iBlack 3D Steel mesh Reballing Stencil for Android Qualcomm EMMC DDR MTK 6582 MSM8917 8916 8937 8953 Steel mesh
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QIANLI iBlack 3D Steel mesh Reballing Stencil for Android Qualcomm EMMC DDR MTK 6582 MSM8917 8916 8937 8953 Steel mesh
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Qianli 3D Positioning Black Reballing Stencil for Android Mobile Phone Repairing for EMMC DDR MTK 6582 MSM8917 8916 8937 8953
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QIANLI iBlack 3D Steel mesh Reballing Stencil for Android Qualcomm EMMC MSM EMMC General DDR KIRIN 655 659 MSM 8937 2AA MTK 6582
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QIANLI iBlack 3D Steel mesh Reballing Stencil for Android Qualcomm EMMC DDR MTK 6582 MSM8917 8916 8937 8953 Steel mesh
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QIANLI iBlack 3D BGA Stencil MTK6582 MSM8917 2AA/8937/8953 1AB/B01-AB/8940 1AA/8916/8909/8939/8996 SDM636/660 Reball Tin Plant
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AMAOE U3 Phone CPU Tin Planting Platform Set for MSM8916/8939/8917/8940/8953/8952 0.12mm BGA Reballing Steel Mesh
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