Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK 6582 MSM8916 8917 8909 8939 8953 8940 Kirin 665 659

Qianli iBlack 3D BGA Reballing Stencil Kit for Android Qualcomm EMMC DDR MTK 6582 MSM8916 8917 8909 8939 8953 8940 Kirin 665 659
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sku: 33024806631
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$4.93
Shipping from: China
   Technical Details
Application: For Android phone repair
DIY Supplies: Electrical
Feature: Square hole reballing stencil
gmtCreate: 1558681200
is customized: Yes
Material: Stainless steel
Model Number: Qianli iBlack Reballing Stencil for Android
Thickness: 0.12MM
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