NC-559-ASM TPF Solder Flux Anti-Wet No-Clean 100g Cream AMTECH Solder Flux

Description NC 559 ASM TPF Flux Anti Wet No Clean 100g Cream AMTECH Solder PasteNC 559 as a leave in help paste residue color is very light there is a very value of SIR Recommended for BGA CSP and other solder ball array repair and fill the ball When using smoke less no residue Affordable Suitable for North and south bridge cards cell phone chip video chip BGA solder bumping Also can use off the tin the effect is very ideal The residue was less bright spot less smoke no pungent odor do not run the ball Package includes 1 x Solder pasteDetails pictures