100g No Clean Lead Clean Solder Flux Solder Paste

Volume 100 g bottleIt can be used for rework sphere or pin attachment to BGA PGA and CSP packages and assemble operations such as Flip Chip attachment to PWB substrates It is a necessary and helpful tool in BGA reballing Feature Excellent capacity of solder stickinessExcellent Anti wet CapacityWidely used on BGA PGA CSP packages and flip chip operationSuitable for multiple PCB reflowNo clean and Lead free for environmental protectionPackage included 1 x Solder Flux Solder PasteDetails pictures