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For Xiaomi Series Snapdragon 730 Repairman High Precision Stencils CPU BGA iC Reballing Planting Tin Plate

For Xiaomi Series Snapdragon 730 Repairman High Precision Stencils CPU BGA iC Reballing Planting Tin Plate

sku: 2725419

ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW

$3.20

Shipping from: China

Description

1. High temperature resistance, fast and convenient2. This stencil is easy to use no matter you are a new or expert.3. Precise position4. This product is small and strong5. High success rate of planting tin,the solder balls can be formed once after you are proficient

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