For Xiaomi Series MSM8953 / MT6797 Repairman High Precision Stencils CPU BGA iC Reballing Planting Tin Plate
Description
1. High temperature resistance, fast and convenient2. This stencil is easy to use no matter you are a new or expert.3. Precise position4. This product is small and strong5. High success rate of planting tin,the solder balls can be formed once after you are proficient
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