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Amaoe Mbga-B5 BGA Reballing Stencil Platform For Android CPU SM8250 MSM8998 MT6891Z SM7225 MSM8937 MSM8994 SDM660 SDM439 MSM8917
sku: 1005004929812999
$15.80
605.00 грн.
+4%
~
625.00 грн.
$15.80, $1.00 = 39.70 грн.
1,460.00 руб.
-1%
~
1,450.00 руб.
$15.80, $1.00 = 91.49 руб.
€ 14.80
-1%
~
€ 14.60
$15.80, € 1.00 = $1.08
Shipping from: China
the store does not ship to your country
Price history chart & currency exchange rate
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13%
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Amaoe High quality For MSM8996 MSM8976 MSM8992 MSM8953 MSM8937 SDM660 MSM8998 MSM8952 MSM8974 MSM8994 CPU RAM BGA Reball Stencil
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AMAOE Mbga-B15 Mbga-B16 SM8250 Tin Planting Platform Set Glue Removing Station Positioning Plate 0.12mm BGA Reballing Stencil
7%
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4%
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1%
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Amaoe BGA Reballing Stencil Template Station kits for MSM8996 MSM8994 MSM8998 CPU RAM BGA Reball Platform Solder Steel Net
1%
$8.80
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1%
$6.63
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-2%
1%
$31.04
Amaoe QU1-8 BGA Reballing Stencil Kit for Qualcomm CPU RAM SM8250/SDM439/SM8350 888 SDM 7150 7250 7350 4250 6125 6115 Steel Mesh
1%
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$4.98
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1%
$4.99
Amaoe QU2 BGA Reballing Stencil for For Qualcomm CPU MSM8953 MSM8998 MSM8953 MSM8937 MSM8916 CPU RAM
1%
$31.50
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1%
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1%
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1%
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0.033, 1.54
7/.012,164 0=.000,078 1=.000,582/1 2=.000,559/1 3=.000,457/1 4=.001,563/1 5=.004,709/1 6=.000,092/1 7=.004,202/36
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