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Amaoe BGA Stencil Reballing Platform kits For Qualcomm MSM8952 MSM8917 MSM8909 MSM8953 SDM450 MSM8953 MSM8916 MSM8937 SDM660
sku: 1005006209222997
$8.80
~
348.00 грн.
$8.80, $1.00 = 39.55 грн.
815.00 руб.
-1%
~
810.00 руб.
$8.80, $1.00 = 91.80 руб.
~
€ 8.20
$8.80, € 1.00 = $1.07
Shipping from: China
the store does not ship to your country
Price history chart & currency exchange rate
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Amaoe QU2 BGA Reballing Stencil For Qualcomm MSM Series MSM8953 MSM8937 MSM8998 MSM8916 CPU IC Chip Tin Plant Net Steel Mesh
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Amaoe QU2 BGA Reballing Stencil For Qualcomm MSM Series MSM8953 MSM8937 MSM8998 MSM8916 CPU IC Chip Tin Plant Net Steel Mesh
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Amaoe QU2 BGA Reballing Stencil For Qualcomm MSM Series MSM8953 MSM8937 MSM8998 MSM8916 CPU Chip IC Tin Plant Net Steel Mesh
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Amaoe QU2 BGA Reballing Stencil For Qualcomm MSM Series MSM8953 MSM8937 MSM8998 MSM8916 CPU Chip IC Tin Plant Net Steel Mesh
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Wylie WL-56 BGA Reballing Stencil For Huawei MSM8937 MSM8953 1AB MSM8916 MSM8940 MSM8952 BGA153 BGA221 Power wifi Chip IC Mesh
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Wylie WL-56 BGA Reballing Stencil For Huawei MSM8937 MSM8953 1AB MSM8916 MSM8940 MSM8952 BGA153 BGA221 Chip IC Black Steel Mesh
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Wylie WL-56 BGA Reballing Stencil For Huawei MSM8937 MSM8953 1AB MSM8916 MSM8940 MSM8952 BGA153 BGA221 Power wifi Chip IC Mesh
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Amaoe QU2 BGA Reballing Stencil 0.12mm for Qualcomm CPU MSM8953 MSM8937 MSM8998 8916 SDM450 CPU
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Wylie BGA Reballing Stencil for Huawei CPU NAND Power IC Chip MSM8916 MSM8940 MSM8953 1AB MSM8952 MSM8937 MSM8953 B01 BGA221
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Amaoe QU2 BGA Reballing Stencil For Xiaomi Huawei Oppo Vivo Qualcomm CPU RAM MSM8937 MSM8998 MSM8953 B01/1AB MSM8916 Soldering
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Amaoe QU2 BGA Reballing Stencil for For Qualcomm CPU MSM8953 MSM8998 MSM8953 MSM8937 MSM8916 CPU RAM
4%
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2%
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Amaoe QU3 BGA Reballing Stencil for For Qualcomm CPU MSM8909 MSM8928 MSM8952 MSM8612 SDM660 MSM8940 MSM7225A RAM
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1%
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1%
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Amaoe BGA Reballing Stencil for Qualcomm MSM8953/MSM8937/MSM8998-B/MSM8953-1AB/MSM8916 CPU IC Chip Tin Planting Soldering Net
1%
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Amaoe QU2 BGA Reballing Stencil for Qualcomm CPU MSM8953 MSM8937 MSM8998 8916 SDM450 Soldering Tin Net Repair Tools 0.12mm
1%
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1%
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1%
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For Qualcomm CPU MSM8996 MSM8976 MSM8992 MSM8953 MSM8937 MSM8998 MSM8916 BGA Reballing Stencil Heating Reball Tin Net Template
1%
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BGA Reballing Stencil For Qualcomm CPU MSM7225 MSM8928 MSM8940/8937 SDM660 MSM8909 MSM8994 MSM8952 MSM8974 MSM8960 MSM8612
1%
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Black stencil MSM8916 MSM8937 MSM8953 1AB MSM8940 MSM8952 BGA153 BGA221 Power wifi flash nand CPU BGA Stencil Reballing Template
1%
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0.039, 5.49
7/.014,936 0=.000,109 1=.000,864/1 2=.000,645/1 3=.000,439/1 4=.001,091/1 5=.005,343/1 6=.000,115/1 7=.006,439/36
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