YJ-QCC3003 Bluetooth 5.0 Module for Power Amplifier Board

Details 1 The Bluetooth core uses QCC3003 chip supports A2DP AVRCP HFP AAC I2S etc and uses 16M SPI FLASH memory chip DAC adopts imported PCM51022 The electrolytic capacitor adopts the gold word SANYO 470UF 16V electrolytic capacitor to ensure strong and continuous power support 3 High precision chip resistors are selected for the resistors to ensure a good signal to noise ratio of the whole machine 4 The PCB adopts 1 6mm thick double sided board 2 0 oz copper thickness and the whole process of spraying tin to ensure good passing performance of large and small currents First class PCB quality Basic parameters PCB size 60 59MMVoltage DC 7 12V inside outside Bluetooth 5 0 receiving distance is about 10 metersPackage includes 1 x Bluetooth 5 0 Module