YCS 138 150 183 199 215 Solder Paste for Mobile Phone BGA CPU PCB Repair Less Residue Dedicated Ball Planting Tin Welding Paste

YCS 138 150 183 199 215 Solder Paste for Mobile Phone BGA CPU PCB Repair Less Residue Dedicated Ball Planting Tin Welding Paste
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sku: 1005008310811958
$6.45+6%
$6.85
Shipping from: China
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