XINZHIZAO L23 BGA Reballing Stencil Platform for Mobile Phone A8-A16 MTK EMMC Qualcomm HUAWEI CPU Tin Planting Soldering Tools

XINZHIZAO L23 BGA Reballing Stencil Platform for Mobile Phone A8-A16 MTK EMMC Qualcomm HUAWEI CPU Tin Planting Soldering Tools
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sku: 1005005637843813
$6.18
Shipping from: China
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