XIEC Soldering Paste 1 Set BGA Reballing Low Residue Professional PCB Board Repair Welding Paste

Description: Equipped with a needle this syringe solder paste can be replaced for a long service life. This syringe solder paste is characterized by good wetting property and easy soldering which makes your repair work more easily. It is constructed of synthetic resin material. The diameter of this product is 3.5cm. The length of this product is 11.5cm. It is suitable for BGA ball semiconductor packaging repair. Item Name: Syringe Solder Paste Material: Synthetic Resin Style: A: No-clean B: Strong Stickiness (Optional) Net Content: 10cc Volatility: 300 Self Ignition Point: 387 Celsius Degree Specific Gravity: 1.05-1.08 Flash Point: 168F Flash Point: 92 Celsius Degree PH Value: 6.5 Applicable Temperature: 50-60 Celsius Degree Features: Environmental Easy-soldering Widely Used Size Details: Diameter: 3.5cm per 1.38(Approx.) Length: 11.5cm per 4.53(Approx.) Notes: Due to the light and screen setting difference the item s color may be slightly different from the pictures. Please allow slight dimension difference due to different manual measurement. Package Includes: 1 x Syringe Solder Paste 1 x Needle