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Wylie WL-75 BGA Reballing Stencil for HUAWEI Kirin 985/820/Hi6290/Hi6290L CPU IC Chip Honor 30/30s/X10 Nova 7/7Pro/7SE Tin Net
sku: 1005003554179966
$2.80
-1%
$2.77
106.00 грн.
+4%
~
110.00 грн.
$2.77, $1.00 = 39.65 грн.
263.00 руб.
-3%
~
255.00 руб.
$2.77, $1.00 = 92.05 руб.
€ 2.62
-1%
~
€ 2.60
$2.77, € 1.00 = $1.07
Shipping from: China
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Wylie WL-75 BGA Reballing Stencil for HUAWEI Honor 30/30s/X10 Nova 7/7Pro/7SE Kirin 985/820/Hi6290/Hi6290L CPU IC Chip Tin Net
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Wylie WL-75 BGA Reballing Stencil for HUAWEI Kirin 985/820/Hi6290/Hi6290L CPU IC Chip Honor 30/30s/X10 Nova 7/7Pro/7SE Tin Net
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Wylie WL-75 BGA Reballing Stencil Kirin985/820/Hi6290/Hi6290L CPU for HUAWEI Honor 30/30s/X10 Nova 7/7 Pro/7SE Planting Tin Net
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0.044, 3.85
6/.016,890 0=.000,092 1=.000,700/1 2=.003,646/1 3=.000,917/1 4=.004,779/1 5=.000,117/1 6=.006,731/36
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