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Wylie WL-60 BGA Reballing Stencil For PM845 PM670 SDR845 WCD9335 WCD9341 SDM845 BCM43596 Bluetooth CPU RAM Audio Power IC Chip
sku: 1005003118506618
$2.80
-1%
$2.77
106.00 грн.
+4%
~
110.00 грн.
$2.77, $1.00 = 39.70 грн.
263.00 руб.
-2%
~
258.00 руб.
$2.77, $1.00 = 92.99 руб.
€ 2.62
-1%
~
€ 2.60
$2.77, € 1.00 = $1.07
Shipping from: China
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Wylie WL-60 BGA Reballing Stencil For PM845 PM670 SDR845 WCD9335 WCD9341 SDM845 BCM43596 Bluetooth CPU RAM Audio Power IC Chip
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Wylie WL-60 BGA Reballing Stencil For PM845 PM670 SDR845 WCD9335 WCD9341 SDM845 BCM43596 Bluetooth CPU RAM Audio Power IC Chip
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$2.80
Wylie WL-60 BGA Reballing Stencil For PM845 PM670 SDR845 WCD9335 WCD9341 SDM845 BCM43596 Bluetooth CPU RAM Audio Power IC Chip
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Wylie WL-60 BGA Reballing Stencil For PM845 SDM845 SDR845 HI6421 HI6423 WCN9341 PM670 HI6363 CPU Power AUDIO Bluetooth IC CHIP
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$2.95
Wylie WL-60 BGA Reballing Stencil For SDM845 CPU Power AUDIO Bluetooth IC CHIP PM670 HI6363 PM845 SDR845 HI6421 HI6423 WCN9341
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Wylie WL-60 BGA Reballing Stencil For SDM845 CPU Power AUDIO Bluetooth IC CHIP PM670 HI6363 PM845 SDR845 HI6421 HI6423 WCN9341
76%
$2.89
Wylie WL-60 BGA Reballing Stencil For PM845 SDM845 SDR845 HI6421 HI6423 WCN9341 PM670 HI6363 CPU Power AUDIO Bluetooth IC CHIP
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PM670 PM670A/L SDR845 WCD9335 WCD9341 SDM845 BCM43596 PM845 Audio WIFI NAND CPU RAM Power IC Chip BGA Stencil Reballing Template
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Mechanic BGA Reballing Stencil for SDM845/PM670A/L/PM670/HI6363/HI6421/BCM43596/WCD9335/WCN9341/SDR845 HI6423 CPU Power IC Chip
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Wylie WL-60 BGA Reballing Stencil For PM845 SDM845 SDR845 HI6421 HI6423 WCN9341 PM670 HI6363 CPU Power AUDIO Bluetooth IC CHIP
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PM670 PM670A/L SDR845 WCD9335 WCD9341 SDM845 BCM43596 PM845 Audio WIFI NAND CPU RAM Power IC Chip BGA Stencil Reballing Template
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Mechanic BGA Reballing Stencil for SDM845/PM670A/L/PM670/HI6363/HI6421/BCM43596/WCD9335/WCN9341/SDR845 HI6423 CPU Power IC Chip
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Wylie WL-69 BGA Reballing Stencil For Samsung S9 S9+ Plus Snapdragon SDM845 Exynos9810 PM845 BGA153 CPU RAM Power WiFi IC Chip
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Wylie WL-69 BGA Reballing Stencil For Samsung S9 S9+ Plus Snapdragon SDM845 Exynos9810 PM845 BGA153 CPU RAM Power WiFi IC Chip
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Black stencil PM845 PM670 PM670A/L SDR845 WCD9335 WCD9341 SDM845 BCM43596 Audio Power IC Chip BGA Stencil Reballing Template
36%
$2.77
Wylie WL-67 BGA Reballing Stencil For PM8150C PM562 PM6150 PM660 PM845 PM670 PM540 PM640 PM489 PM8150A PMi632 PM Power IC Chip
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WL-60 PM670A HI6421 SDR845 SDM845 BCM43596 PM845 HI6423 WCN9341 PM670 Power AUDIO Bluetooth IF IC Chip BGA Reballing Stencil
34%
$5.55
WL-60 PM670A HI6421 SDR845 SDM845 BCM43596 PM845 HI6423 WCN9341 PM670 Power AUDIO Bluetooth IF IC Chip BGA Reballing Stencil
31%
$3.89
WL-60 PM670A HI6421 SDR845 SDM845 BCM43596 PM845 HI6423 WCN9341 PM670 Power AUDIO Bluetooth IF IC Chip BGA Reballing Stencil
-1%
29%
$2.77
Wylie WL-67 BGA Reballing Stencil For PM8150C PM562 PM6150 PM660 PM845 PM670 PM540 PM640 PM489 PM8150A PMi632 PM Power IC Chip
22%
$3.99
Black stencil SDM845 PM845 PM670 PM670A/L SDR845 WCD9335 WCD9341 BCM43596 Audio Power IC Chip BGA Stencil Reballing Template
21%
$6.25
WL-60 BCM43596 SDM845 PM845 SDR845 WCN9341 HI6423 WCD9335 HI6363 PM670 PM670A/L HI6421WIFI Power IC Chip BGA Reballing Stencil
20%
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Black stencil PM845 PM670 PM670A/L SDR845 WCD9335 WCD9341 SDM845 BCM43596 Audio Power IC Chip BGA Stencil Reballing Template
14%
$8.12
Wylie BGA Reballing Stencil for SDM845 PM845 SDR845 WCN9341 HI6363 PM670 PM670A/L HI6421 BCM43596 HI6423 WCD9335 Power PM IC
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Black steel BGA reballing stencil for SDM845 PM670 HI6421 HI6363 SDR845 WCN9341 PM845 WCD9335 BCM43596
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