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Universal BGA Reballing Stencil kit for iPhone CPU A8-A16 Hisilicon Qualcomm MTK IC Chip Glue removal tin planting platform
sku: 1005005562880124
$26.69
1,000.00 грн.
+5%
~
1,050.00 грн.
$26.69, $1.00 = 39.45 грн.
~
2,440.00 руб.
$26.69, $1.00 = 91.56 руб.
~
€ 24.90
$26.69, € 1.00 = $1.07
Shipping from: China
the store does not ship to your country
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