S500 3D BGA Reballing Stencil CPU Module BGA Reballing Repair Tool for Phone 5 5S 6 6S 7G 7Plus 8 8P

Features High speed numerical control technology and high temperature resistant toughened materials production round square precise hole posttion make steel net more durable easier to take off the net more efficient New patented phone X Middle Layer Motherboardfor Phone X Middle layer motherboard Assisting professionals to do Phone X BGA reballing in the most convenient and safest way Specification Type A7 CPU A8 CPU A9 CPU A10 CPU A11 CPU Package included 1 x BGA Reballing Tool Details pictures