PHONEFIX Qualcomm MSM8994 MSM8974 BGA Reballing Stencil for Phone Universal Solder Template 0.12MM Direct Heating Rework Tool

PHONEFIX Qualcomm MSM8994 MSM8974 BGA Reballing Stencil for Phone Universal Solder Template 0.12MM Direct Heating Rework Tool
sku: 32998589608
$5.99
Shipping from: China
   Technical Details
Advantage: Best BGA Repair Solution for Phone Circuit Board
Application: phone repair tool
Brand Name: DIYPHONE
Color: As Pictures Shows
Compacity: for MSM8994 A (B) / MSM8974 A(B) / MSM8960 A(B)
DIY Supplies: Electrical
Features: Ventilation With Heat-dispersion Hole Design
Function: for Phone Qualcomm Base Rework
item name: AMAOE BGA Reballing Stencils Template
Material: Imported Japan Steel Sheet
Model Number: for MSM8994 A (B) / MSM8974 A(B) / MSM8960 A(B)
Package: Box
Period of Dispatch: Within 3 Days
Size: 0.12mm Tin Plant Template
Suitable for: for Phone Universal Soldering Rework Station
Supplier: DIYPHONE
Thickness: 0.12mm
Type: Qualcomm MSM8974/MSM8960 BGA Reballing
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