PHONEFIX Multifunction BGA Reballing Stencil Template for iPhone 8 8P X CPU NAND Flash IC Chip Heating Repair Tin Net

PHONEFIX Multifunction BGA Reballing Stencil Template for iPhone 8 8P X CPU NAND Flash IC Chip Heating Repair Tin Net
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sku: 33002384023
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$1.99
Shipping from: China
   Technical Details
Advantage: Best BGA Repair Solution for iPhone Circuit Board
Application: Phone Repair Tool
Brand Name: DIYPHONE
Color: As Pictures Shows
Compacity: for iPhone 8 8P X
design: Professional for iPhone 8 Series BGA Reballing
DIY Supplies: Electrical
Features: Quickly for Reballing the BGA IC
Function: for iPhone 8 8 P X CPU/Font/Audio /Power IC Repairing
item name: Multi-purpose BGA Reballing Stencil Template
Material: High Quality Steel Sheet
Model Number: Ultra-thin Tin Reballing Steel Mesh
Package: Box
Packing: Bag
Period of Dispatch: Within 3 Days
Size: For Multi-model iPhone Repairing
Suitable for: for iPhone 8 Series Motherboard Maintenance Engineer
Supplier: DIYPHONE
Type: Phone Repair tool
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