PHONEFIX MSM8996 CPU Universal Series BGA Reballing Stencil Template for Samsung Galaxy S9 S8 S7 S6 Motherboard Solder Repair
sku: 32983898012
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$5.99
Shipping from: China
Technical Details
| Advantage: | Best BGA Repair Solution for Huawei Samsung Circuit Board |
| Application: | phone repair tool |
| Brand Name: | DIYPHONE |
| Color: | As Pictures Shows |
| Compacity: | for Phone Motherboard BGA IC Chips Rework |
| DIY Supplies: | Electrical |
| Features: | Multi-purpose Samsung S8 Note8 BGA Reballing Stencil Template |
| Function: | for Samsung Phone BGA IC Reballing |
| item name: | BGA Reballing Stencils Template |
| Material: | Imported Japan Steel Sheet |
| Model Number: | Samsung S9 S8 S7 S6 |
| Package: | Box |
| Size: | BGA Reballing Stencil |
| Suitable for: | for Samsung C7010 J610 CPU BGA Reballing |
| Supplier: | DIYPHONE |
| Thickness: | 0.12mm |
| Type: | Phone Repair tool |
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