PHONEFIX IC Chip BGA Reballing Stencils Solder template for iPhone 5/5S/6/6P/6S/6SP/7/8/X CPU NAND Power IC Repair Tin Nets
sku: 4000125921640
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$3.99
Shipping from: China
Technical Details
| Advantage: | Prevent Bulges, Avoid Hump On the BGA Tin Reballing |
| Application: | Mobile phone repair tool |
| Brand Name: | DIYPHONE |
| Color: | As Pictures Shows |
| design: | Precision UP Down Layer Reballing Template |
| DIY Supplies: | Electrical |
| Features: | for iPhone CPU BGA IC Chips Repairing |
| Function: | for iPhone Font/Audio/Power IC Rework |
| item name: | Precision BGA Reballing Stencil |
| Model Number: | BGA Reballing Stencils |
| Package: | Case |
| Size: | New |
| Suitable for: | for iPhone USB Control IC Soldering Repair |
| Type: | Combination |
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