PHONEFIX BGA Reballing Stencil Template for Samsung Huawei MSM8996 G1037 MTK Xiaomi BGA IC Chips Reballing Soldering Repair Tool

PHONEFIX BGA Reballing Stencil Template for Samsung Huawei MSM8996 G1037 MTK Xiaomi BGA IC Chips Reballing Soldering Repair Tool
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sku: 32981037391
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$1.99
Shipping from: China
   Technical Details
Advantage: Best BGA Repair Solution for Huawei Samsung Circuit Board
Application: phone repair tool
Brand Name: DIYPHONE
Color: As Pictures Shows
Compacity: for Huawei Xiaomi Samsung Series
DIY Supplies: Electrical
Features: BGA Soldering Rework Assistant
Function: Phone BGA Reballing Kit for Rework Station
item name: BGA Reballing Stencils Template for Huawei Series
Material: Steel Sheet
Model Number: MSM8996 Huawei/G1037 MTK Xiaomi/MT8392V Samsung MTK Huawei
Package: Box
Size: BGA Reballing Stencil
Suitable for: Samsung Huawei LG MTK Xiaomi
Supplier: DIYPHONE
Type: Phone Repair tool
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