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Mijing Z21 MAX CPU BGA Reballing Stencil Platform for iPhone, A8-A16, Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Templat
артикул: 1005005904832577
$24.53
995.00 грн.
+2%
~
1,010.00 грн.
$24.53, $1.00 = 41.35 грн.
2,210.00 руб.
+3%
~
2,280.00 руб.
$24.53, $1.00 = 92.77 руб.
€ 22.60
-3%
~
€ 21.90
$24.53, € 1.00 = $1.12
Доставка з: Китай
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Mijing Z21 MAX CPU BGA Reballing Stencil Platform for iPhone, A8-A16, Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Templat
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Mijing Z21 MAX CPU BGA Reballing Stencil Platform For iPhone A8-A16 For Hisilicon For Qualcomm For Snapdragon IC Chip Fixture
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Mijing Z21 Max Universal CPU BGA Reballing Stencil Platform For iPhone A8-A16 Android IC Chip Chipest Planting Tin Template
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Mijing Z21 MAX CPU BGA Reballing Stencil Platform For iPhone A8-A16 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template
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Mijing Z21 MAX CPU BGA Reballing Stencil Platform For iPhone A8-A16 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template
+7%
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$17.28
SFDER Z21 MAX CPU BGA Reballing Stencil Platform For IPhone A8-A16 Android Qualcomm Snapdragon IC Chip Planting Tin Template
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Mijing Z21 MAX CPU BGA Reballing Stencil Platform For iPhone A8-A17 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template
47%
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Mijing Z21 MAX Chip Tin Planting Table FOR IPHONE A8-A16 Hisilicon Qualcomm Snapdragon BGA CPU Reballing Stencil
40%
$25.77
MIJING Z21 MAX Chip Tin Planting Station Precise Positioning For A8-A16 Hisilicon Qualcomm Snapdragon BGA CPU Reballing Stencil
35%
$29.99
MIJING Android CPU IPHONE A8-A16 Hisilicon Qualcomm Snapdragon Tin Planting Platform BGA CPU Reballing Stencil
33%
$25.27
MIJING Z21 MAX Chip Tin Planting Station Precise Positioning For A8-A16 Hisilicon Qualcomm Snapdragon BGA CPU Reballing Stencil
32%
$25.99
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
-1%
29%
$23.01
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
28%
$25.75
MIJING Z21 MAX Chip Tin Planting Station Precise Positioning For A8-A16 Hisilicon Qualcomm Snapdragon BGA CPU Reballing Stencil
+1%
26%
$21.63
Mijing Z21 Max Universal CPU BGA Reballing Stencil Platform For Phone A8-A16 Android Phone IC Chip Planting Tin Template Fixture
24%
$25.36
MIJING Z21 MAX Chip Tin Planting Station Precise Positioning For A8-A16 Hisilicon Qualcomm Snapdragon BGA CPU Reballing Stencil
22%
$21.33
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20%
$23.99
Mijing Z21 MAX CPU Chip Tin Planting Station For iPhone A8-A16 Hisilicon Qualcomm BGA CPU Reballing Stencil Soldering Kits
19%
$23.01
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
18%
$25.99
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
11%
$29.80
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
8%
$25.16
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5%
$20.58
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+13%
4%
$33.72
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1%
$33.72
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1%
$20.23
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Про нас
Контакти
0.044, 12.7
6/.017,162 0=.000,063 1=.000,714/1 2=.004,590/1 3=.000,477/1 4=.005,350/1 5=.000,139/1 6=.005,892/36
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