Mijing Z21 MAX CPU BGA Reballing Stencil Platform For iPhone A8-A17 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template

Mijing Z21 MAX CPU BGA Reballing Stencil Platform For iPhone A8-A17 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template
thumb
thumb
thumb
thumb
thumb
thumb
sku: 1005004837300280
$17.50
Shipping from: China
   Price history chart & currency exchange rate

Customers also viewed