Mechanic BGA Reballing Stencil kir for iPhone CPU A8-A15 HUAWEI Hisilicon 960 985 990 980 Kirin 9000 Qualcomm Snapdragon 888 865

Mechanic BGA Reballing Stencil kir for iPhone CPU A8-A15 HUAWEI Hisilicon 960 985 990 980 Kirin 9000 Qualcomm Snapdragon 888 865
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sku: 1005004823664587
$10.60-6%
$9.97
Shipping from: China
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