Mechanic 3D BGA Reballing Stencil Repair Tool for iPhone X Motherboard Middle Layer A12 PCB Groove Planting Tin Template Reballing

Mechanic 3D BGA Reballing Stencil Repair Tool for iPhone X Motherboard Middle Layer A12 PCB Groove Planting Tin Template Reballing
Eachine1
sku: 1468639
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$17.88
Shipping from: China
   Description
Features: 3D laser square hole BGA reballing stencil template. High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. New patented iphone X Middle Layer Motherboard for iPhone X Middle layer motherboard. High temperature resistant synthetic stone made positioning slot. Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way. Package included: 1 x 3D BGA Reballing Stencils Details pictures:
   Price history chart & currency exchange rate

Customers also viewed