MIJING M21 BGA Reballing Stencil Magnetic Base for Mobile Phone Middle Layer Soldering CPU NAND CHIP IC Tin Planting Fixture

MIJING M21 BGA Reballing Stencil Magnetic Base for Mobile Phone Middle Layer Soldering CPU NAND CHIP IC Tin Planting Fixture
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sku: 1005005633084866
$19.29
Shipping from: China
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