MECHANIC BGA Desoldering Braid Solder Wick 1.0mm 1.5mm 2.0mm 2.5mm 3.0mm 3.5mm 4.0mm Tin Remover Wire Wick Soldering Accessory
Technical Details
Application: | Mobile phone motherboard repair |
diameter: | 1.5 2.0 2.5 3.0 3.5mm |
Flux Content: | 0 |
Length: | 1.5m |
Material: | Copper / Copper Alloy |
Melting Point: | 0 |
Model Number: | desoldering wire |
Weight: | 8g |
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