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MDM9645 BGA Stencil For iPhone 7 7Plus For Qualcomm Baseband CPU IC Reball Solder Tin Plant Heat Template 0.10mm Thickness
sku: 1005002086260746
$4.80
191.00 грн.
+4%
~
198.00 грн.
$4.80, $1.00 = 41.35 грн.
433.00 руб.
+3%
~
446.00 руб.
$4.80, $1.00 = 92.92 руб.
€ 4.46
-3%
~
€ 4.32
$4.80, € 1.00 = $1.11
Shipping from: China
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MDM9645 BGA Stencil For iPhone 7 7Plus For Qualcomm Baseband CPU IC Reball Solder Tin Plant Heat Template 0.10mm Thickness
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