Kaisi Bottom layer Board BGA Reballing Stencil Plant Tin Platform for iPhone A10 A11 A12 A13 CPU Solder Template kit

Kaisi Bottom layer Board BGA Reballing Stencil Plant Tin Platform for iPhone A10 A11 A12 A13 CPU Solder Template kit
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sku: 1005003199811012
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$10.00
Shipping from: China
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