Japan Steel BGA Stencil for Samsung S9 S9+ Exynos9810 SDM845 CPU Heat Planting Tin Net 0.12mm Thickness Template
Technical Details
Application: | BGA Stencil for Samsung S9 S9+ Exynos9810 SDM845 CPU |
Material: | Stainless Steel |
Model Number: | BGA Stencil |
Thickness: | 0.12mm Thickness |
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