Japan Steel BGA Stencil for Samsung S9 S9+ Exynos9810 SDM845 CPU Heat Planting Tin Net 0.12mm Thickness Template

Japan Steel BGA Stencil for Samsung S9 S9+ Exynos9810 SDM845 CPU Heat Planting Tin Net 0.12mm Thickness Template
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sku: 33031503070
$4.50
Shipping from: China
   Technical Details
Application: BGA Stencil for Samsung S9 S9+ Exynos9810 SDM845 CPU
Material: Stainless Steel
Model Number: BGA Stencil
Thickness: 0.12mm Thickness
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