Japan Stainless Steel BGA Stencil for Samsung S8/S8+/NOTE8/MSM8998/CPU/G9500/G955U/N9500 BGA Reballing Plate Solder Template

Japan Stainless Steel BGA Stencil for Samsung S8/S8+/NOTE8/MSM8998/CPU/G9500/G955U/N9500 BGA Reballing Plate Solder Template
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артикул: 33027205405
$4.50
Доставка из: Китай
   Характеристики
Application: BGA Stencil for Samsung S8/S8+/NOTE8/MSM8998/CPU/G9500/G955U/N9500
Model Number: BGA Stencil
Thickness: 0.12mm Thickness
Материал: Stainless Steel
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