For Qualcomm MSM8994 MSM8974 MSM8960 0.12MM Multi-Function QCOM MSM CPU BGA Reballing Stencil Plant Tin Steel Net

For Qualcomm MSM8994 MSM8974 MSM8960 0.12MM Multi-Function QCOM MSM CPU BGA Reballing Stencil Plant Tin Steel Net
sku: 1005005422715946
$6.35-1%
$6.28
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99%
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67%
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-1%
49%
$4.59
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46%
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45%
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42%
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-1%
30%
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-40%
28%
$2.08
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27%
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25%
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24%
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PHONEFIX Qualcomm MSM8994 MSM8974 BGA Reballing Stencil for Phone Universal Solder Template 0.12MM Direct Heating Rework Tool
23%
$5.99
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-76%
19%
$2.28
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14%
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-2%
12%
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6%
$3.18
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-76%
3%
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-3%
1%
$4.85
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1%
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+28%
1%
$2.87
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1%
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1%
$3.79
High quality For MSM8994 MSM8974 MSM8960 CPU + RAM BGA Reballing Stencil 0.12mm Direct Heating Template Anti Drum-up
BGA Reballing Stencil For Qualcomm CPU MSM7225 MSM8928 MSM8940/8937 SDM660 MSM8909 MSM8994 MSM8952 MSM8974 MSM8960 MSM8612
1%
$4.80
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+1%
1%
$8.88
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1%
$4.99
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