For Huawei CPU RAM IC BGA Stencil HI6260/3670/3680 Reballing Chip Tin Plant Net Solder Heat Template Amaoe 0.12mm Thickness HU:3

For Huawei CPU RAM IC BGA Stencil HI6260/3670/3680 Reballing Chip Tin Plant Net Solder Heat Template Amaoe 0.12mm Thickness HU:3
sku: 33003485073
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$7.50
Shipping from: China
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