EMMC EMCP UFS BGA 153 162 169 186 221 254 Universal Maintenance Platform Planting Tin Net Suit Chip Repair tools
sku: 32848783273
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$4.51
Shipping from: China
Technical Details
| Application: | Mobile Phone eMMC eMCP BGA153 |
| BGA Model: | BGA162/169/186/221/254 |
| Brand Name: | wozniak |
| Dissipation Power: | Good |
| DIY Supplies: | Metalworking |
| Magnetic base: | Precision positioning plat |
| Mobile phone maintenance: | Professional mobile phone repair kit |
| Model Number: | EMMC EMCP UFS BGA 153 162 169 186 221 254 |
| Multi-function product: | High quality stee |
| Operating Temperature: | suitable for BGA153 A89 reballing cell |
| Package: | Case |
| Range of use: | EMMC/EMCP/UFS Platform for |
| Size: | 10*10*3 |
| Type: | BGA plant tin |
| Use: | BGA reballing Stencil BGA153 162 189 |
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