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BGA Stencil For HUAWEI P40 Mate 30 PRO RS Nova 6 Honor V30 PRO HI3690 CPU Stencil Replanting tin seed beads BGA Stencil
sku: 1005005903124223
$3.96
+1%
$4.00
152.00 грн.
+7%
~
162.00 грн.
$4.00, $1.00 = 40.55 грн.
370.00 руб.
-6%
~
348.00 руб.
$4.00, $1.00 = 86.99 руб.
~
€ 3.74
$4.00, € 1.00 = $1.07
Shipping from: China
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Wylie WL-70 BGA Reballing Stencil For HUAWEI Mate 30/30Pro/RS/Nova 6/Honor V30/V30Pro Kirin990 HI3690 CPU RAM Power WiFi IC Chip
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25%
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Wylie WL-70 BGA Reballing Stencil For HUAWEI Mate 30/30Pro/RS/Nova 6/Honor V30/V30Pro Kirin990 HI3690 CPU RAM Power WiFi IC Chip
24%
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14%
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12%
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