BGA Reballing Stencil for Samsung J1/J2/J3/J4/J100H/J320F/G570M/Exynos7570/3475/SC9830A/7730S/CPU BGA Planting Tin Template

BGA Reballing Stencil for Samsung J1/J2/J3/J4/J100H/J320F/G570M/Exynos7570/3475/SC9830A/7730S/CPU BGA Planting Tin Template
sku: 33023524473
$4.50
Shipping from: China
   Technical Details
Application: BGA Reballing for SC9830A/7730S
Function: BGA Reballing for Samsung Exynos7570/3475
Material: Stainless Steel
Model Number: BGA Reballing
Particle Size: 1-10μm
Style: BGA Stencil for Samsung J1/J2/J3/J4/J100H/J320F/G570M
Thickness: 0.12mm
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