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BGA Reballing Stencil for SAMSUNG Exynos Series CPU RAM 3475 8895 8890 2100 1080 3830XGO 9609 990 Debonding Soldering Repair
sku: 1005006408769598
$2.99
117.00 грн.
+4%
~
121.00 грн.
$2.99, $1.00 = 40.60 грн.
275.00 руб.
-3%
~
267.00 руб.
$2.99, $1.00 = 89.33 руб.
€ 2.76
+1%
~
€ 2.80
$2.99, € 1.00 = $1.07
Shipping from: China
the store does not ship to your country
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Amaoe EU1-5 BGA Reballing Stencil For SAMSUNG Exynos 7885/9820/9610/990/8890/7580/8895/7880/1080/2100/9609/9815 CPU RAM Chip IC
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BGA Chip Reballing stencil kit for Samsung Exynos CPU 8890 5430 7420 7880 7580 8895 9810 3475 3470 7570 7885 9820 880 980 990
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1%
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6/.012,345 0=.000,070 1=.000,670/1 2=.000,511/1 3=.000,717/1 4=.005,180/1 5=.000,100/1 6=.005,167/36
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