BGA IC Adhesive Removing Liquid Glue Epoxy Remover Cell Phone CPU Chip Cleaner

Features: - It can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily. - It can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.And it won't do harm to your circuit board and components. - This is a environment friendly item and it's very safe. Doesn't contain any Benzene Coderivative substances with cause leukaemia. How to use: 1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing. 2. Place a plastic bag or film on the top and cover the PCB board. 3. Wait approx. 20 minutes 4. Redo step 1 to step 3. 5. To remove the softened sealing glue in the outside of BGA IC chip with a tweezers. Please pay attention to avoid damaging routes surrounding BGA and copper foil circuit around main board when removing the glue. 6. Heat up the chip with a air gun (300 deg.C). The glue in the bottom will get melt and soften by heat; 7. To remove the chip with a tweezers or cutter. Caution: This glue removing liquid shall not touch skin, eyes. Please close it after using. If touched by accident, Please wash with water immediately. Specification: Usage: Electronic Components Quantity: 30ml Size Of Box: 3.8cm x 3.7cm x 8.8cm (1cm=0.393Inches) Package includes: 1 x Adhesive Removing Liquid 1 x User Manual Details pictures: