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Amaoe SAM2 BGA Reballing Stencil For SAMSUNG S7/S7+ G9300/G9350/G930F Exynos 8890/MSM8996 CPU RAM WIFI POWER IC Chip Steel Mesh
sku: 1005002701132498
$4.64
175.00 грн.
+5%
~
184.00 грн.
$4.64, $1.00 = 39.70 грн.
437.00 руб.
-3%
~
424.00 руб.
$4.64, $1.00 = 91.33 руб.
€ 4.34
-1%
~
€ 4.30
$4.64, € 1.00 = $1.08
Shipping from: China
the store does not ship to your country
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Amaoe SAM2 BGA Reballing Stencil For Samsung S7 G9300 G9350 G9308 G930F Exynos8890 MSM8996 CPU RAM WIFI POWER Chip Solder tin
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Amaoe SAM2 For SAMSUNG S7/S7+ G9300/G9350/G930F Exynos 8890/MSM8996 CPU RAM WIFI POWER Chip BGA Stencil IC Solder Reballing Tin
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Amaoe SAM2 BGA Reballing Stencil For Samsung S7 G9300 G9350 G9308 G930F For Exynos8890 MSM8996 CPU Tin Planting Soldering Net
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0.049, 4.35
6/.016,119 0=.000,080 1=.000,859/1 2=.000,988/1 3=.000,972/1 4=.005,413/1 5=.000,091/1 6=.007,796/36
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