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Amaoe SAM10 BGA Reballing Stencil For S10 S10+ Plus Note10 5G G9730 G975 G977 For Exynos9820 SM8150 CPU Power IC Tin Plant Net
sku: 1005005567525165
$4.35
164.00 грн.
+5%
~
172.00 грн.
$4.35, $1.00 = 39.60 грн.
~
407.00 руб.
$4.35, $1.00 = 93.56 руб.
~
€ 4.08
$4.35, € 1.00 = $1.07
Shipping from: China
the store does not ship to your country
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Amaoe SAM10 BGA Reballing Stencil For S10 S10+ Note10 5G G9730 G975 G977 Exynos9820 SM8150 CPU Power PA IC Tin Plant Net
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Amaoe SAM10 BGA Reballing Stencil For S10 S10+ Note10 5G G9730 G975 G977 Exynos9820 SM8150 CPU Power PA IC Tin Plant Net
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Amaoe SAM10 BGA Reballing Stencil For S10 S10+ Note10 5G G9730 G975 G977 Exynos9820 SM8150 CPU Power PA IC Tin Plant Net
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Amaoe SAM10 BGA Reballing Stencil Template For Exynos9820 855 SM8150 CPU For Sansung S10 S10+ Note10 5G G9730 G975 G977 N975 IC
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Amaoe SAM10 BGA Reballing Stencil Template For Exynos9820 855 SM8150 CPU For Sansung S10 S10+ Note10 5G G9730 G975 G977 N975 IC
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Amaoe SAM10 BGA Reballing Stencil Template For Samsung S10 +/NOTE10/5G/G975/977/N975 SMB8150 Exynos 9820 CPU IC Tin Plant Net
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Amaoe SAM10 BGA Reballing Stencil For Sansung S10 S10+ S10 Plus Note10 5G G9730 G975 G977 N975 For Exynos9820 Tin Planting Net
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Amaoe SAM10 BGA Reballing Stencil Template For Samsung S10 +/NOTE10/5G/G975/977/N975 SMB8150 Exynos 9820 CPU IC Tin Plant Net
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Amaoe SAM10 BGA Reballing Stencil For Sansung S10 S10+ S10 Plus Note10 5G G9730 G975 G977 N975 For Exynos9820 Tin Planting Net
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Amaoe SAM10 BGA Reballing Stencil Template For Samsung S10 +/NOTE10/5G/G975/977/N975 SMB8150 Exynos 9820 CPU IC Tin Plant Net
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Amao SAM:10 Reballing Stencil For Samsung S10/S10+/NOTE10 G9730/G975/G977/N975 Cpu Exynos9820/SM8150 0.12mm Thickness Tin
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Amaoe SAM10 For SAMSUNG S10/S10+/Note10/G9730/G975/N975 SM8150/Exynos 9820/855 CPU RAM WIFI Chip BGA Stencil IC Solder Reballing
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Amaoe SAM10 For SAMSUNG S10/S10+/Note10/G9730/G975/N975 SM8150/Exynos 9820/855 CPU RAM WIFI Chip BGA Stencil IC Solder Reballing
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AMAOE Exynos9820/855 SM8150 CPU RAM For SAMSUNG S10/S10+/NOTEO10/G975/G977/N975 IC CHIP BGA reballing Stencil Tin Solder Heat
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0.043, 3.98
7/.016,102 0=.000,065 1=.000,578/1 2=.000,659/1 3=.000,470/1 4=.001,632/1 5=.005,089/1 6=.000,098/1 7=.007,576/36
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