Amaoe Middle Layer BGA Reballing Stencil for Huawei Mate40Pro 0.12MM CPU IC Chip Motherboard Solder Tin Plant Net Steel Mesh

Amaoe Middle Layer BGA Reballing Stencil for Huawei Mate40Pro 0.12MM CPU IC Chip Motherboard Solder Tin Plant Net Steel Mesh
sku: 1005004090403119
$2.95
Shipping from: China
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