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Amaoe LG2 BGA Reballing Stencil Template For LG G5/G6 VS995/V20/H868/Q8 MSM8996 CPU RAM PMIC POWER AUDIO WIFI IC CHIP Solder TIN
sku: 1005001839539213
$4.40
167.00 грн.
+4%
~
174.00 грн.
$4.40, $1.00 = 39.50 грн.
411.00 руб.
-2%
~
403.00 руб.
$4.40, $1.00 = 91.53 руб.
€ 4.14
-1%
~
€ 4.10
$4.40, € 1.00 = $1.07
Shipping from: China
the store does not ship to your country
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Amaoe LG2 BGA Reballing Stencil Template For LG G5/G6 VS995/V20/H868/Q8 MSM8996 CPU RAM PMIC POWER AUDIO WIFI IC CHIP Solder TIN
98%
$4.50
Amaoe LG2 BGA Reballing Stencil Template For LG G5/G6 VS995/V20/H868/Q8 MSM8996 CPU RAM PMIC POWER AUDIO WIFI IC CHIP Solder TIN
94%
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Amaoe LG2 BGA Reballing Stencil Template For LG G5/G6 VS995/V20/H868/Q8 MSM8996 CPU RAM PMIC POWER AUDIO WIFI IC CHIP Solder TIN
-9%
77%
$2.04
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Amaoe LG2 MSM8996 CPU/RAM For LG G5/G6/VS995/H850/V20/H868/G6+/Q8 Power wifi audio Chip BGA Stencil IC Solder Reballing Tin
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MSM8996 CPU/RAM For LG G5/G6 VS995/H850/V20/H868/Q8 PMIC POWER AUDIO WIFI IC CHIP BGA TIN Reballing Stencil Solder Template
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Amaoe LG2 BGA Reballing Stencil For LG G5 G6 VS995/H850/V20/H868/Q8 G6+ MSM8996 CPU RAM PMIC POWER AUDIO WIFI IC CHIP Steel Mesh
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Amaoe LG2 BGA Reballing Stencil For LG G5 G6 VS995/H850/V20/H868/Q8 G6+ MSM8996 CPU RAM PMIC POWER AUDIO WIFI IC CHIP Steel Mesh
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Amaoe LG2 BGA Reballing Stencil For LG G5 G6 VS995 H850 V20 H868 G6Plus Q8 MSM8996 CPU IC Chip Tin Plant Net Solder Steel Mesh
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IC Chip BGA Reballing Stencil Kit Solder Template for LG G5 G6 VS995/H850/V20/G6+/H868/Q8 MSM8996 CPU Tin Planting Net
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IC Chip BGA Reballing Stencil Kit Solder Template for LG G5 G6 VS995/H850/V20/G6+/H868/Q8 MSM8996 CPU Tin Planting Net
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$7.05
Amaoe LG2 BGA Reballing Stencil Template For VS995 H850 V20 G6+ H868 CPU IC Chip Tin Plant Net Solder Steel Mesh 0.12MM
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0.047, 2.47
6/.019,267 0=.000,104 1=.000,805/1 2=.003,439/1 3=.001,004/1 4=.005,442/1 5=.000,131/1 6=.008,446/36
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