50g Lead-Free Solder Paste Strong Adhesive Tin Soldering Flux with Scraper Welding Flux for BGA SMD PGA Rework Reballing Station
Technical Details
| Feature: | Welding Tools Accessories |
| Ingredient: | SN99/AG0.3/CU0.7 |
| Ingredients: | Sn63/Pb37 |
| Melting Point: | 226-229 C |
| Model Number: | Best-705 |
| Particle Size: | 25-48μm |
| Size: | 35 x 18 mm |
| Storage temperature: | 5-10 |
| Type: | Lead-free brand silver tin lead solder paste |
| Usage: | for Chips Computer Phone LED BGA SMD PGA PCB Repair Tool |
| Viscosity: | 75 (Pa.S) |
| Weight: | 50 g |
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